1-1825093-2
TE Connectivity Ltd.
Conn DIP Socket SKT 8 POS 2.54mm Solder ST Thru-Hole Tube DIP Sockets CONN IC SOCKET 8 POS DIP 30AU Diplomate DIP Socket 2.54x7.62mm 8P IC & Component Sockets DIP .3CL 08P S&F CFRM CU/AU Conn DIP Socket SKT 8 POS 2.54mm Solder ST Thru-Hole Tube Product Highlights:DIP SocketNumber of Positions = 8Row-to-Row Spacing = 7.62 mmThrough Hole Contact Termination TypeMount Style = VerticalSearch Keywords:IC sockets, solderless, NIC, Network Interface Cards, PC Cards, EIA RS-415, MIL-S-83734, dual in-line IC package, CONNECTOR, DIP RECEPTACLE, THT, 8WAY Socket,DIP;DualLeaf;8Pos.;0.100In.cen.;ThruHole;0.310In.;Ber.Copper;Gold TE Connectivity Diplomate 垂直 2.54mm 节距 8 路, 通孔 模压引脚 封闭式框架 DIL 插座
规格参数
商业参数
产品DIP / SIP Sockets
产品类别IC & Component Sockets
标准包装数量Rail / Tube
工厂包装数量52
合规参数
RoHSLead free / RoHS Compliant
海关税号85366910
抗辐射加固No
无铅定义Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c
RoHS/ELV合规状态RoHS compliant, ELV compliant
材料阻燃等级UL 94V-0
电气参数
接触电阻30
绝缘电阻10,000
机械参数
颜色Black
深度10 mm
间距2.54 mm
高度5.33 mm
重量0.05
底座类型DIP
包装方式Tube
排间距7.62mm
外壳样式Closed
端接方式Solder
触头类型Dual Leaf
柱间距7.62 [0.300]
安装类型Through Hole
连接器类型:DIP
接触镀层Tin
安装样式Vertical
排数2
高度（英寸）5.33 [0.210]
外形（宽 x 高）Standard
触头材料Beryllium Copper
壳体材料Thermoplastic Glass Reinforced
总长度2.54 [0.100]
包装数量Tube
端接样式Through Hole
触点数8
接触件端接:Through Hole Vertical
绝缘材料 - 类型Thermoplastic
位数8
端子柱长度3.25 [0.128]
接触镀层厚度30µin (0.76µm)
位置或引脚数（网格）8 (2 x 4)
产品信息
备注ONLY sockets with straight solder tails are recommended for automatic insertion
类型DIP Socket
连接器性别SKT
系列:Diplomate
产品特性Closed Frame
制造商全称Tyco Electronics
产品子类型DIP Socket
专有名称DIPLOMATE DL
其他规格Straight
环境参数
温度范围125