1-1825093-4

1-1825093-4

TE Connectivity Ltd.

Conn DIP Socket SKT 16 POS 2.54mm Solder ST Thru-Hole Tube DIP Sockets CONN SOCKET VERT 16 POS 30AU DIP Diplomate DIP Socket 2.54x7.87mm 16P Socket; DIP;Dual Leaf;16 Pos.;0.100In.cen.;Thru Hole;0.310In.;Ber. Copper;Gold IC & Component Sockets DIP .3CL 16P S&F CFRM CU/AU Conn DIP Socket SKT 16 POS 2.54mm Solder ST Thru-Hole Tube Product Highlights:DIP SocketNumber of Positions = 16Row-to-Row Spacing = 7.62 mmThru HoleMount Style = VerticalSearch Keywords:IC sockets, solderless, NIC, Network Interface Cards, PC Cards, EIA RS-415, MIL-S-83734, dual in-line IC package, DIP SOCKET, 16POS, THROUGH HOLE Socket,DIP;DualLeaf;16Pos.;0.100In.cen.;ThruHole;0.310In.;Ber.Copper;Gold

规格参数

商业参数

参数
产品DIP / SIP Sockets
产品类别IC & Component Sockets
标准包装数量Rail / Tube
工厂包装数量26

合规参数

参数
RoHSLead free / RoHS Compliant
海关税号85366910
抗辐射加固No
无铅定义Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c
RoHS/ELV合规状态RoHS compliant, ELV compliant
材料阻燃等级UL 94V-0

电气参数

参数
接触电阻30
绝缘电阻10,000

机械参数

参数
颜色Black
深度10 mm
间距2.54 mm
高度5.33 mm
重量0.002
包装方式Tube
排间距0.3in
外壳样式Closed
端接方式Solder
触头类型Dual Leaf
柱间距7.62 [0.300]
安装类型Through Hole
连接器类型:DIP Socket
接触镀层Tin
安装样式Vertical
排数2
高度(英寸)5.33 [0.210]
外形(宽 x 高)Standard
触头材料Beryllium Copper
壳体材料Thermoplastic Glass Reinforced
总长度2.54 [0.100]
包装数量Tube
触点数16
接触件端接:Solder
绝缘材料 - 类型Thermoplastic
位数16
端子柱长度3.25 [0.128]
接触镀层厚度30µin (0.76µm)
位置或引脚数(网格)16 (2 x 8)

产品信息

参数
备注ONLY sockets with straight solder tails are recommended for automatic insertion
类型DIP Socket
连接器性别SKT
系列:DIPLOMATE DL
产品特性Open Frame
制造商全称Tyco Electronics
产品子类型DIP Socket
专有名称DIPLOMATE DL
其他规格Straight

环境参数

参数
温度范围125